CENTRAL GLASS & CERAMIC RESEARCH INSTITUTE

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Materials in microelectronic and optoelectronic packaging

by Ling, Hung C, ed.
Type: materialTypeLabelBookPublisher: The American Ceramic Society Westerville, Ohio 1993Edition: Third Internatio nal Ceramic Science and Technology Congress.Description: viii, 471 p.ISBN: 0-944904-63-7.Online resources: http://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=10490
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