TY  - BOOK
AU  - Ling, H C, ed.
TI  - Materials in microelectronic and optoelectronic packaging
PY  - 1993///
CY  - American Ceramic Society
PB  - Ohio
UR  - http://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=10299
ER  -