TY  - BOOK
AU  - Tummala, Rao R
TI  - Fundamentals of microsystems packaging
PY  - 2001///
CY  - McGraw-Hill
PB  - New York
UR  - http://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=11596
ER  -