TY  - BOOK
AU  - Park, Jong-Hee, ed.
ED  - Sundarshan,T. S., ed.
TI  - Chemical vapor deposition
SN  - 0-87170-692-X
PY  - 2001///
CY  - ASM International
PB  - Ohio
KW  - Chemical vapor deposition
KW  - Vapor-plating
KW  - Refractory coating
N1  - Surface engineering series; v.2
UR  - http://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=11725
ER  -