TY  - BOOK
AU  - Sebastian, M T
TI  - Dielectric materialsals for wireless communication
SN  - 978-0-08-045330-9
PY  - 2008///
CY  - Elsevier
PB  - Amsterdam
UR  - http://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=11760
ER  -