TY  - BOOK
AU  - 
TI  - Silicon carbide and related materials: proceedings
SN  - 978-087849-425-5
PY  - 2005///
PB  - Trans Tech
N1  - Materials Science Forum V 527-529
UR  - http://192.168.8.161:80/cgi-bin/koha/opac-detail.pl?biblionumber=Ubiblionumber
ER  -