| 000 | 00535nam a2200181Ia 4500 | ||
|---|---|---|---|
| 003 | CGCRI | ||
| 005 | 20140812102858.0 | ||
| 008 | 140225s2014 xx 000 0 eng d | ||
| 020 | _a0-944904-63-7 | ||
| 040 |
_cCGCRI _bENG |
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| 041 | _hENG | ||
| 100 | _aLing, Hung C, ed. | ||
| 245 | _aMaterials in microelectronic and optoelectronic packaging | ||
| 250 | _aThird Internatio nal Ceramic Science and Technology Congress | ||
| 260 |
_aThe American Ceramic Society _bWesterville, Ohio _c1993 |
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| 300 | _aviii, 471 p. | ||
| 942 | _cBK | ||
| 999 |
_c10490 _d10490 |
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| 856 |
_uhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=10490 _yhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=10490 |
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