000 00397nam a2200157Ia 4500
003 CGCRI
005 20140812102735.0
008 140225s2014 xx 000 0 eng d
040 _cCGCRI
_bENG
041 _hENG
100 _aAll-Union Conference on Semiconductor Materials,
245 _aSemiconductor materials
260 _aConsultants Bureau
_bNew York
_c1966
300 _a139p.
942 _cBK
999 _c5562
_d5562
856 _uhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=5562
_yhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=5562