000 00487nam a2200169Ia 4500
003 CGCRI
005 20140812102845.0
008 140225s2014 xx 1000 0 eng d
040 _cCGCRI
_bENG
041 _hENG
100 _aJackson, K A,ed.
111 _aElectronic packaging materials science 11:proceedings vol.
245 _aElectronic packaging materials science 11:proceedings vol.
260 _aMaterials Research Society
_bPittsburgh
_c1986
300 _a1-347p.
942 _cBK
999 _c9773
_d9773
856 _uhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=9773
_yhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=9773