| 000 | 00402nam a2200157Ia 4500 | ||
|---|---|---|---|
| 003 | CGCRI | ||
| 005 | 20140812102849.0 | ||
| 008 | 140225s2014 xx 000 0 eng d | ||
| 040 |
_cCGCRI _bENG |
||
| 041 | _hENG | ||
| 100 | _aYan, Man F.,ed. | ||
| 245 | _aCeramic substrates and packages for electronic applications | ||
| 260 |
_aAmerican Ceramic Society _bOhio _c1989 |
||
| 300 | _a608p. | ||
| 942 | _cBK | ||
| 999 |
_c9984 _d9984 |
||
| 856 |
_uhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=9984 _yhttp://14.139.222.13:80/cgi-bin/koha/opac-detail.pl?biblionumber=9984 |
||